Sony patent outlines heat-pipe cooling for potential PS6

Sony Interactive Entertainment filed a patent for a heat dissipation system that could be used in a future PlayStation model. The filing describes heat pipes combined with a heat sink to cool components such as processor chips.

The patent describes each heat pipe as having “a sintered body layer formed by sintering a powder, such as a metal laminated on the inner wall surface of a tube.” The sintered layer would be formed in a cylindrical shape inside the tube, leaving a cavity where a working fluid would be sealed.

The filing says the working fluid would be chosen based on the pipe material and could be as simple as water. The sintered layer is presented as a structure to guide the fluid and support heat transfer inside the pipe.

The document notes a “demand for structures with higher cooling performance” when devices are used in different postures and describes the design as intended to maintain cooling performance regardless of console orientation.

Sony used a liquid metal thermal interface for the PlayStation 5. That approach was reported to have damaged some launch units when consoles were placed vertically. Sony adjusted cooling and chassis details for later PS5 Slim and PS5 Pro models.

The patent filing does not include a production timeline and does not guarantee the design will appear in a shipping product. The document records technical options and shows ongoing development of heat-pipe and sealed-fluid cooling approaches for future hardware.

The filing was submitted to patent authorities and provides technical details but does not specify product names, release dates or manufacturing plans.